The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Apr. 10, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Xusheng Wu, Ballston Lake, NY (US);

Chengwen Pei, Danbury, CT (US);

Ziyan Xu, San Diego, CA (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/088 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 21/3105 (2006.01); H01L 21/02 (2006.01); H01L 29/16 (2006.01); H01L 29/78 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0886 (2013.01); H01L 21/02236 (2013.01); H01L 21/31053 (2013.01); H01L 21/823431 (2013.01); H01L 29/0649 (2013.01); H01L 29/16 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01); H01L 29/7851 (2013.01);
Abstract

A method of forming straight and narrow fins in the channel region and the resulting device are provided. Embodiments include forming Si fins separated by STI regions; recessing the STI regions to reveal the Si fins; forming a nitride layer over the STI regions and the Si fins; forming an OPL over the nitride layer between the Si fins; recessing the OPL to expose portions of the nitride layer over the Si fins; removing exposed portions of the nitride layer; removing the OPL; forming an oxide layer over exposed portions of the Si fins; forming a dummy gate over the nitride layer and the oxide layer perpendicular to the Si fins and surrounded by an ILD; removing the dummy gate and the oxide layer forming a cavity; thinning the Si fins in the cavity; and forming a RMG in the cavity.


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