The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Jan. 06, 2017
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Tetsuichiro Kasahara, Nagano, JP;

Hideki Matsuzawa, Nagano, JP;

Masayuki Okushi, Nagano, JP;

Naoya Sakai, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49537 (2013.01); H01L 21/4821 (2013.01); H01L 23/293 (2013.01); H01L 23/3142 (2013.01); H01L 23/49548 (2013.01); H01L 23/49589 (2013.01); H01L 23/49861 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/181 (2013.01);
Abstract

A lead frame includes a first lead frame including a first lead; a second lead frame including a second lead, the second lead frame being stacked on the first lead frame so that a space is formed between the first lead frame and the second lead frame, and the second lead being bonded to the first lead; and a resin portion provided in the space formed between the first lead frame and the second lead frame, wherein each of the first lead and the second lead includes an embedded portion embedded in the resin portion, and a protruding portion protruded from the resin portion, and wherein the embedded portion of the first lead and the embedded portion of the second lead are bonded in the resin portion.


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