The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Jan. 07, 2014
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Shinichi Hirano, Utsunomiya, JP;

Kohei Yamada, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/673 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68707 (2013.01); G03F 7/707 (2013.01); G03F 7/70783 (2013.01); G03F 7/70925 (2013.01); H01L 21/67288 (2013.01); Y10T 279/34 (2015.01);
Abstract

A processing apparatus for processing a substrate chucked by a chuck installed on a stage includes: a conveying unit configured to convey the substrate to the chuck; a robot configured to selectively convey, to the stage, a pressing member capable of pressing the substrate to reduce a warp of the substrate chucked by the chuck and a cleaning member capable of cleaning a chuck surface; and a controller configured to cause the robot holding the pressing member to execute pressing processing for correcting the warp of the substrate and cause the robot holding the cleaning member to execute cleaning processing of the chuck surface.


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