The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Sep. 21, 2016
Applicant:

Laird Technologies, Inc., Earth City, MO (US);

Inventors:

Mohammadali Khorrami, Foxboro, MA (US);

Paul Francis Dixon, Sharon, MA (US);

Assignee:

Laird Technologies, Inc., Earth City, MO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H01P 1/201 (2006.01); H05K 9/00 (2006.01); H01L 23/34 (2006.01); H01P 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); H01L 23/34 (2013.01); H01P 1/201 (2013.01); H01P 3/12 (2013.01); H05K 1/0203 (2013.01); H05K 1/0216 (2013.01); H05K 9/0032 (2013.01); H05K 9/0081 (2013.01);
Abstract

According to various aspects, exemplary embodiments are disclosed of thermal interface materials including electrically-conductive material, shields including thermal interface materials, and related methods. In an exemplary embodiment, a thermal interface material generally includes a top surface, a bottom surface, and one or more outer side surfaces extending between the top and bottom surfaces. Electrically-conductive material is along and/or adjacent the one or more outer side surfaces. The thermal interface material may be configured to be operable as a waveguide through which energy below a cutoff frequency cannot flow. The electrically-conductive material may be parallel with a direction of heat flow from a heat source to a heat removal/dissipation structure when the bottom surface is positioned against or adjacent the heat source and the top surface is positioned adjacent or against the heat removal/dissipation structure.


Find Patent Forward Citations

Loading…