The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Dec. 22, 2014
Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Shuji Nishimoto, Okegawa, JP;

Yoshiyuki Nagatomo, Saitama, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); H01L 23/3735 (2013.01); H01L 24/83 (2013.01); H01L 23/473 (2013.01); H01L 24/32 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83439 (2013.01); H01L 2924/13055 (2013.01);
Abstract

An elongated trench () is formed so as to connect the Ag layer () and the exposed part of the circuit layer stretching out around the Ag layer (). The trench () a narrow and elongated recessed part penetrating the glass layer () and the aluminum oxide film (A) from the Ag layer () to reach the surface () of the circuit layer (). The extended part (), which is a part of the Ag layer () flatted along with the inner surface () of the trench (), is formed in the trench (). The Ag layer () and the circuit layer () are electrically connected directly by Ag with a low electric resistance value by the extended part () in the portion where the trench () is formed.


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