The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Dec. 27, 2015
Applicant:

Shanghai Micro Electronics Equipment (Group) Co., Ltd., Shanghai, CN;

Inventors:

Xu Zhou, Shanghai, CN;

Haicang Cui, Shanghai, CN;

Fei Ni, Shanghai, CN;

Lili Ge, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03B 27/58 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70725 (2013.01); G03F 7/709 (2013.01); G03F 7/70758 (2013.01); G03F 7/70766 (2013.01);
Abstract

A silicon wafer edge protection device having: a horizontal motion assembly; vertical motion assembly; speed regulating device, which is in signal connection with the vertical motion assembly and used for regulating vertical motion assembly motion speed; flexible bumper assembly, which is connected to the horizontal motion assembly and vertical motion assembly and used for reducing the amplitude of vibration of the silicon wafer edge protection device when a collision occurs; and control device, which is in signal connection with the speed regulating device and used for sending a control signal to the speed regulating device to control motion of the vertical motion assembly. The silicon wafer edge protection device can prevent a wafer stage from undergoing an instantaneous strong impact and prevent a silicon wafer from being crushed. When a collision occurs, the wafer stage and the silicon wafer can be protected. Production efficiency is also improved.


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