The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Jun. 10, 2014
Applicant:

Shengyi Technology Co., Ltd., Dongguan, CN;

Inventor:

Jiang You, Dongguan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08G 59/50 (2006.01); C08J 5/24 (2006.01); C08L 79/02 (2006.01); H05K 1/03 (2006.01); B32B 27/38 (2006.01); B32B 27/42 (2006.01); C08K 3/22 (2006.01); C08K 3/34 (2006.01); C08K 3/40 (2006.01); C08K 5/00 (2006.01); C08L 63/04 (2006.01); C08G 14/06 (2006.01); C08L 61/06 (2006.01); C08L 61/34 (2006.01); C08G 59/32 (2006.01); C08G 59/62 (2006.01); C08G 59/68 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); B32B 27/38 (2013.01); B32B 27/42 (2013.01); C08G 14/06 (2013.01); C08G 59/3218 (2013.01); C08G 59/5073 (2013.01); C08G 59/621 (2013.01); C08G 59/686 (2013.01); C08J 5/24 (2013.01); C08K 3/22 (2013.01); C08K 3/34 (2013.01); C08K 3/40 (2013.01); C08K 5/0066 (2013.01); C08L 61/06 (2013.01); C08L 61/34 (2013.01); C08L 63/04 (2013.01); C08L 79/02 (2013.01); H05K 1/0373 (2013.01); B32B 2260/021 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2264/102 (2013.01); B32B 2264/104 (2013.01); B32B 2307/204 (2013.01); B32B 2307/306 (2013.01); B32B 2307/3065 (2013.01); B32B 2307/714 (2013.01); B32B 2307/726 (2013.01); B32B 2307/7265 (2013.01); B32B 2307/734 (2013.01); B32B 2457/08 (2013.01); C08J 2363/00 (2013.01); C08J 2379/02 (2013.01); C08J 2379/04 (2013.01); C08J 2461/06 (2013.01); C08J 2463/00 (2013.01); C08J 2479/02 (2013.01); C08J 2479/04 (2013.01); C08L 2201/02 (2013.01); C08L 2201/22 (2013.01); C08L 2203/20 (2013.01); C08L 2205/03 (2013.01); H05K 2201/012 (2013.01); H05K 2201/015 (2013.01);
Abstract

The technology discloses a halogen-free resin composition and a prepreg and a laminate used for a printed circuit. The resin composition comprises: alkyl phenol epoxy resin; benzoxazine resin, alkyl phenol novolac curing agent, and phosphorus-containing flame retardant. The alkyl phenol epoxy resin has many alkyl branched chains in its molecular structure, making the composition have excellent dielectric properties, a higher glass transition temperature, low water absorption, and good heat resistance. Mixing benzoxazine resin into the composition can further reduce dielectric constant, dielectric loss value and water absorption of the cured product. With an alkyl phenol novolac curing agent, the molecular structure will have many alkyls, excellent dielectric properties and low water absorption. A prepreg and a laminate used for printed circuit prepared using the resin composition have low dielectric constants, dielectric loss factors, and water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance.


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