The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Apr. 29, 2013
Applicants:

Koh Young Technology Inc., Seoul, KR;

Kyungpook National University Industry Academic Cooperation Foundation, Daegu, KR;

Inventors:

Min-Young Kim, Daegu, KR;

Min-Su Kim, Seoul, KR;

Ja-Geun Kim, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41F 15/08 (2006.01); B41F 33/00 (2006.01); B41F 15/14 (2006.01); H05K 3/34 (2006.01); H05K 3/00 (2006.01); B41F 15/12 (2006.01); B41M 1/12 (2006.01); H05K 3/12 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
B41F 33/00 (2013.01); B41F 15/08 (2013.01); B41F 15/14 (2013.01); H05K 3/0008 (2013.01); H05K 3/34 (2013.01); B41F 15/12 (2013.01); B41F 33/0036 (2013.01); B41F 33/0081 (2013.01); B41M 1/12 (2013.01); H05K 1/0269 (2013.01); H05K 3/1216 (2013.01); H05K 3/3484 (2013.01); H05K 2201/09918 (2013.01);
Abstract

The present invention relates to a method of correcting a position of a stencil mask which comprises receiving fiducial information from a screen printer, extracting position information of a pad and position information of a solder formed on a board through measuring by a solder paste inspection apparatus, estimating an x, y offset value and a rotating amount of a stencil mask based on the fiducial information by using the position information of the pad and the solder, and transmitting the x,y offset value and the rotating amount of the stencil mask to the screen printer. Thus, a reliability of solder forming process may be increased by correcting a stencil mask position by transmitting a feedback of an x,y offset value and a rotating amount of the stencil mask from a solder paste inspection apparatus, in which the x,y offset value and the rotating amount are estimated based on fiducial information transmitted from the screen printer.


Find Patent Forward Citations

Loading…