The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2018

Filed:

Feb. 27, 2015
Applicant:

Nippon Steel & Sumitomo Metal Corporation, Tokyo, JP;

Inventors:

Takashi Aigo, Tokyo, JP;

Wataru Ito, Tokyo, JP;

Tatsuo Fujimoto, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C30B 25/20 (2006.01); C30B 29/36 (2006.01); C30B 25/16 (2006.01); C23C 16/32 (2006.01); C23C 16/44 (2006.01); C30B 25/08 (2006.01); C30B 25/10 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C30B 25/20 (2013.01); C23C 16/325 (2013.01); C23C 16/44 (2013.01); C30B 25/08 (2013.01); C30B 25/10 (2013.01); C30B 25/165 (2013.01); C30B 29/36 (2013.01); H01L 21/0262 (2013.01); H01L 21/02378 (2013.01); H01L 21/02428 (2013.01); H01L 21/02433 (2013.01); H01L 21/02529 (2013.01); H01L 21/02634 (2013.01); H01L 21/02661 (2013.01);
Abstract

The present invention provides a method for producing an epitaxial silicon carbide wafer comprising epitaxially growing SiC on an SiC substrate to produce an epitaxial SiC wafer during which further reducing stacking faults and comet defects than the conventional technologies to obtain an epitaxial SiC wafer having a high quality epitaxial film. The method for producing the epitaxial silicon carbide wafer is characterized in that a pre-growth atmosphere gas flowing into the growth furnace before the start of epitaxial growth contains hydrogen gas and has a balance of an inert gas and unavoidable impurities, and the hydrogen gas is contained in 0.1 to 10.0 vol % with respect to the inert gas.


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