The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2018

Filed:

Jul. 18, 2014
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Yongfang Li, Kawasaki, JP;

Ryoichi Inanami, Yokohama, JP;

Akiko Mimotogi, Yokohama, JP;

Takashi Sato, Fujisawa, JP;

Masato Saito, Machida, JP;

Koichi Kokubun, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/02 (2006.01); C25D 11/32 (2006.01); C25D 11/02 (2006.01); C25D 11/00 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
C25D 5/02 (2013.01); C25D 11/005 (2013.01); C25D 11/022 (2013.01); C25D 11/32 (2013.01); G03F 7/0002 (2013.01);
Abstract

According to one embodiment, a pattern transfer mold includes a base body, first and second stacked bodies, first and second electrodes. The base body includes a base unit including a first surface, a first protrusion provided on the first surface and having a first side surface, and a second protrusion provided on the first surface, separated from the first protrusion, and having a second side surface opposing the first side surface. The first stacked body is provided on the first side surface, and includes first conductive layers and a first insulating layer. The second stacked body is provided on the second side surface, separated from the first stacked body, and includes second conductive layers and a second insulating layer. The first electrode is electrically connected to at least one of the first conductive layers. The second electrode is electrically connected to at least one of the second conductive layers.


Find Patent Forward Citations

Loading…