The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2018
Filed:
Mar. 01, 2016
Applicant:
Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;
Inventors:
Hiroyuki Tanabe, Ibaraki, JP;
Daisuke Yamauchi, Ibaraki, JP;
Assignee:
NITTO DENKO CORPORATION, Ibaraki-shi, Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/18 (2006.01); H05K 3/40 (2006.01); H05K 1/02 (2006.01); H05K 3/38 (2006.01); G11B 5/48 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/11 (2013.01); G11B 5/484 (2013.01); H05K 1/0242 (2013.01); H05K 3/181 (2013.01); H05K 3/384 (2013.01); H05K 3/40 (2013.01); H05K 1/09 (2013.01); H05K 1/111 (2013.01); H05K 3/0061 (2013.01); H05K 3/285 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/09081 (2013.01); H05K 2201/10931 (2013.01); H05K 2203/072 (2013.01);
Abstract
A printed circuit board includes first and second insulating layers, a wiring trace, a metal thin film, and a connection terminal. The wiring trace is formed on the first insulating layer. The metal thin film is formed on the wiring trace, and has a thickness larger than 0 nm and not more than 150 nm. The second insulating layer is formed on the first insulating layer to cover the metal thin film. The connection terminal is formed on the first insulating layer to be electrically connected to the wiring trace and exposed from the second insulating layer.