The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Feb. 20, 2014
Applicant:

Intel Ip Corporation, Santa Clara, CA (US);

Inventors:

Michael Glik, Kfar Saba, IL;

Solomon B. Trainin, Haifa, IL;

Ophir Edlis, Modiin, IL;

Ofir Artstain, Natania, IL;

Elad Levy, Rishon LeZion, IL;

Assignee:

INTEL IP CORPORATION, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04W 72/12 (2009.01); H04W 52/02 (2009.01); H04W 72/04 (2009.01); H04W 74/00 (2009.01);
U.S. Cl.
CPC ...
H04W 72/12 (2013.01); H04W 52/0216 (2013.01); H04W 72/04 (2013.01); H04W 72/0446 (2013.01); H04W 74/00 (2013.01); Y02B 60/50 (2013.01);
Abstract

Logic may allocate time slots in a schedule with consideration of thermal dissipation capacities of non-PCP devices. Logic may determine the failure to use a full time slot allocation by a non-PCP device when the non-PCP device has more data to transmit. Logic may determine an adjustment for a schedule based upon duty cycle information provided by a non-PCP device. Logic may receive an indication of a duty cycle. Logic may determine an adjustment to a schedule based upon entrance of the non-PCP device into a power save mode during an incomplete communication with time remaining in the allocated time slot. Logic may determine a duty cycle based upon a thermal measurement. Logic may request a reduced duty cycle based upon a risk of reaching an overheat limit for a non-PCP device. And logic may request an increase in the duty cycle in response to favorable thermal characteristics.


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