The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Oct. 24, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Praneet Adusumilli, Albany, NY (US);

Shanti Pancharatnam, Albany, NY (US);

Alexander Reznicek, Troy, NY (US);

Oscar van der Straten, Guilderland Center, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01); H01L 29/78 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 28/24 (2013.01); H01L 21/02697 (2013.01); H01L 21/76816 (2013.01); H01L 29/785 (2013.01);
Abstract

A resistive material is formed straddling over each semiconductor fin that extends upward from a surface of a substrate. The resistive material is then disconnected by removing the resistive material from atop each semiconductor fin. Remaining resistive material in the form of a U-shaped resistive material liner is present between each semiconductor fin. Contact structures are formed perpendicular to each semiconductor fin and contacting a portion of a first set of the semiconductor fins and a first set of the U-shaped resistive material liners.


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