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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9953945 B1

PDFFull Text
Date of Patent:
Apr. 24, 2018

Filed:

Nov. 17, 2015

Adhesive resin compostition for bonding semiconductors and adhesive film for semiconductors

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Hee Jung Kim, Daejeon, KR;

Jung Hak Kim, Daejeon, KR;

Se Ra Kim, Daejeon, KR;

Kwang Joo Lee, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:

Rothwell, Figg, Ernst & Manbeck, P.C.

Primary Examiner:

David J Buttner

Int. Cl.
CPC ...
C09J 133/04 (2006.01); C09J 7/02 (2006.01); H01L 23/00 (2006.01); C09J 133/14 (2006.01); C09J 133/06 (2006.01); C09J 7/04 (2006.01); C09J 5/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); C09J 5/00 (2013.01); C09J 7/0246 (2013.01); C09J 7/043 (2013.01); C09J 133/068 (2013.01); C09J 133/14 (2013.01); C08L 2201/08 (2013.01); C08L 2201/52 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01); C08L 2205/03 (2013.01); C09J 2201/36 (2013.01); C09J 2203/326 (2013.01); C09J 2205/302 (2013.01); C09J 2205/31 (2013.01); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); H01L 2224/2919 (2013.01); H01L 2924/066 (2013.01); H01L 2924/0635 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/0675 (2013.01);
Abstract

The present invention relates to an adhesive resin composition for bonding semiconductors, including: a (meth)acrylate-based resin including more than 17% by weight of (meth)acrylate-based repeating units containing epoxy-based functional groups; an epoxy resin having a softening point of more than 70° C.; and a phenol resin having a softening point of more than 105° C., wherein the weight ratio of the (meth)acrylate-based resin is 0.48 to 0.65 relative to the total weight of the (meth)acrylate-based resin, the epoxy resin, and the phenol resin, an adhesive film for semiconductors obtained from the resin composition, a dicing die-bonding film including an adhesive layer that includes the adhesive film for semiconductors, a semiconductor wafer including the dicing die-bonding film, and a dicing method for the semiconductor wafer using the dicing die-bonding film.

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