The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Apr. 26, 2016
Applicant:

Corning Incorporated, Corning, NY (US);

Inventor:

Uta-Barbara Goers, Campbell, NY (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); C23F 1/00 (2006.01); H01L 23/498 (2006.01); B23K 26/18 (2006.01); B23K 26/0622 (2014.01); B23K 26/382 (2014.01); H01L 21/48 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); B23K 26/0622 (2015.10); B23K 26/18 (2013.01); B23K 26/382 (2015.10); H01L 21/486 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H05K 3/002 (2013.01); H05K 3/0029 (2013.01); H05K 3/4038 (2013.01); H05K 2203/1383 (2013.01);
Abstract

Work pieces and methods of forming through holes in substrates are disclosed. In one embodiment, a method of forming a through hole in a substrate by drilling includes affixing an exit sacrificial cover layer to a laser beam exit surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location for the through hole, and forming the through hole by repeatedly pulsing the laser beam into an entrance surface of the substrate and through a bulk of the substrate. The method further includes forming a hole in the exit sacrificial cover layer by repeatedly pulsing the laser beam into the through hole formed in the substrate such that the laser beam passes through the laser beam exit surface of the substrate and into the exit sacrificial cover layer.


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