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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9953856 B1

PDFFull Text
Date of Patent:
Apr. 24, 2018

Filed:

Jan. 21, 2015

Protective film-forming film, sheet for forming protective film, complex sheet for forming protective film, and method of producing manufactured product

Applicant:

Lintec Corporation, Tokyo, JP;

Inventors:

Daisuke Yamamoto, Warabi, JP;

Hiroyuki Yoneyama, Nagareyama, JP;

Assignee:

Lintec Corporation, Tokyo, JP;

Attorney:

Christopher Casieri

Primary Examiner:

Brigitte Paterson

Int. Cl.
CPC ...
H01L 21/683 (2006.01); C09J 7/02 (2006.01); C09J 7/00 (2018.01); C09J 11/06 (2006.01); C09J 133/10 (2006.01); H01L 21/268 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); C09J 7/00 (2013.01); C09J 7/02 (2013.01); C09J 7/0203 (2013.01); C09J 7/0285 (2013.01); C09J 11/06 (2013.01); C09J 133/10 (2013.01); H01L 21/268 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); C08K 2201/002 (2013.01); C09J 2201/622 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2205/114 (2013.01); C09J 2400/22 (2013.01); C09J 2467/006 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68336 (2013.01);
Abstract

Provided is protective film-forming sheet () including: a protective film-forming film () having a light transmittance at a wavelength of 1064 nm of 55% or greater and a light transmittance at a wavelength of 550 nm of 20% or less; and a release sheet () which is laminated on one or both faces of the protective film-forming film (). According to this protective film-forming sheet (), it is possible to form a protective film which allows a workpiece such as a semiconductor wafer to have a modified layer disposed in advance therein by a laser so that the workpiece can be split through the application of force thereon, while preventing grinding marks on the workpiece or a product formed therefrom from being visible to the naked eye.

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