The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2018
Filed:
Sep. 23, 2011
Charles Randall Malstrom, Lebanon, PA (US);
David Sarraf, Elizabethtown, PA (US);
Miguel Angel Morales, Fremont, CA (US);
Leonard Henry Radzilowski, Palo Alto, CA (US);
Michael Fredrick Laub, Enola, PA (US);
Charles Randall Malstrom, Lebanon, PA (US);
David Sarraf, Elizabethtown, PA (US);
Miguel Angel Morales, Fremont, CA (US);
Leonard Henry Radzilowski, Palo Alto, CA (US);
Michael Fredrick Laub, Enola, PA (US);
TE CONNECTIVITY CORPORATION, Berwyn, PA (US);
Abstract
A method of manufacturing an electronic module includes providing a conductive strip and a dielectric material. The method includes coating the dielectric material and the conductive strip to form a layered structure having a conductive layer defined by the conductive strip and a dielectric layer defined by the dielectric material. The method includes applying a carrier strip to the layered structure. The method includes processing the conductive layer to form a circuit while the layered structure is on the carrier strip. The method includes removing the carrier strip from the layered structure. The method includes applying the layered structure with the circuit to an electronic module substrate.