The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Mar. 04, 2016
Applicant:

Innovative Micro Technology, Goleta, CA (US);

Inventors:

Christopher S. Gudeman, Lompoc, CA (US);

Paul J. Rubel, Santa Barbara, CA (US);

Marin Sigurdson, Goleta, CA (US);

Assignee:

Innovative Micro Technology, Goleta, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01H 59/00 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01H 49/00 (2006.01); H01H 1/00 (2006.01);
U.S. Cl.
CPC ...
H01H 59/0009 (2013.01); B81B 7/00 (2013.01); B81C 1/00341 (2013.01); H01H 49/00 (2013.01); B81B 2201/012 (2013.01); H01H 2001/0084 (2013.01);
Abstract

Systems and methods for forming an electrostatic MEMS switch include forming a movable cantilevered beam on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate. The cantilevered beam may be formed by etching the perimeter shape in the device layer of an SOI substrate. An additional void may be formed in the movable beam such that it bends about an additional hinge line as a result of the additional void. This may give the beam and switch advantageous kinematic characteristics.


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