The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Sep. 05, 2014
Applicant:

Ememory Technology Inc., Hsinchu, TW;

Inventors:

Jui-Ming Kuo, Taichung, TW;

Chun-Yuan Lo, Taipei, TW;

Chia-Jung Hsu, Taoyuan County, TW;

Wein-Town Sun, Taoyuan County, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/115 (2017.01); H01L 29/51 (2006.01); G11C 5/06 (2006.01); G11C 16/04 (2006.01); G11C 17/16 (2006.01); G11C 17/18 (2006.01); H01L 27/112 (2006.01); H01L 29/423 (2006.01); H01L 29/78 (2006.01); H01L 27/11529 (2017.01); H01L 27/11573 (2017.01); H01L 23/525 (2006.01); G11C 16/10 (2006.01); G11C 16/14 (2006.01); G11C 16/26 (2006.01); H01L 23/528 (2006.01); H01L 27/11524 (2017.01); H01L 29/06 (2006.01); H01L 29/49 (2006.01); H01L 27/11558 (2017.01); H01L 27/11526 (2017.01); H01L 29/93 (2006.01);
U.S. Cl.
CPC ...
G11C 5/06 (2013.01); G11C 16/0408 (2013.01); G11C 16/0425 (2013.01); G11C 16/0433 (2013.01); G11C 16/10 (2013.01); G11C 16/14 (2013.01); G11C 16/26 (2013.01); G11C 17/16 (2013.01); G11C 17/18 (2013.01); H01L 23/528 (2013.01); H01L 23/5252 (2013.01); H01L 27/11206 (2013.01); H01L 27/11524 (2013.01); H01L 27/11526 (2013.01); H01L 27/11529 (2013.01); H01L 27/11558 (2013.01); H01L 27/11573 (2013.01); H01L 29/0649 (2013.01); H01L 29/42328 (2013.01); H01L 29/42368 (2013.01); H01L 29/4916 (2013.01); H01L 29/512 (2013.01); H01L 29/7817 (2013.01); H01L 29/7835 (2013.01); H01L 29/93 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor device and a method for fabricating the same are provided. The semiconductor device includes a substrate, a memory device, and a select transistor. The memory device is located on the substrate. The select transistor is located on the substrate and electrically connected to the memory device. The select transistor includes a select gate, a first dielectric layer, and a second dielectric layer. The select gate is located on the substrate. The first dielectric layer is adjacent to the second dielectric layer, and located between the select gate and the substrate. The first dielectric layer is closer to the memory device than the second dielectric layer. The thickness of the first dielectric layer is greater than the thickness of the second dielectric layer.


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