The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Sep. 30, 2015
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Yusaku Ito, Tokyo, JP;

Hirohide Yano, Tokyo, JP;

Tomoyuki Yaguchi, Tokyo, JP;

Assignee:

Disco Corporation, Tokyo, JP;

Attorney:
Assistant Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G01N 21/95 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); G01N 21/9501 (2013.01); G06T 2207/30148 (2013.01);
Abstract

A wafer inspection method includes a step of picking up an image of a processed face of a wafer, a step of extracting a pixel having a pixel value higher than those of peripheral pixels as a characteristic point from among pixels in each predetermined region of picked up image data to create a first image, and a step of extracting a pixel having a pixel value lower than those of peripheral pixels as a characteristic point from among the pixels in each predetermined region of the picked up image data to create a second image. The first and second images are used to inspect the processed face of the wafer.


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