The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2018
Filed:
Apr. 15, 2010
Applicants:
Shoutian LI, Naperville, IL (US);
Robert Vacassy, Aurora, IL (US);
Jaishankar Kasthuri, Aurora, IL (US);
Inventors:
Shoutian Li, Naperville, IL (US);
Robert Vacassy, Aurora, IL (US);
Jaishankar Kasthuri, Aurora, IL (US);
Assignee:
Cabot Microelectronics Corporation, Aurora, IL (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 (2006.01); B24D 3/32 (2006.01); C09K 3/14 (2006.01); C07D 413/04 (2006.01); C07D 235/06 (2006.01); C07D 403/04 (2006.01); C07D 403/14 (2006.01); C07D 405/14 (2006.01); C07D 413/14 (2006.01); C07D 417/14 (2006.01); C07D 471/04 (2006.01);
U.S. Cl.
CPC ...
C07D 413/04 (2013.01); C07D 235/06 (2013.01); C07D 403/04 (2013.01); C07D 403/14 (2013.01); C07D 405/14 (2013.01); C07D 413/14 (2013.01); C07D 417/14 (2013.01); C07D 471/04 (2013.01);
Abstract
The invention provides a chemical-mechanical polishing pad comprising a polymeric matrix and 0.1-15 wt. % of metal oxide particles. The polymeric matrix has pores, the metal oxide particles are uniformly distributed throughout the pores, and the metal oxide particles have a specific surface area of about 25 m/g to about 450 m/g. The invention further provides a method of polishing a substrate with the polishing pad.