The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

Dec. 09, 2016
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Hiroyuki Tanabe, Osaka, JP;

Naohiro Terada, Osaka, JP;

Yuu Sugimoto, Osaka, JP;

Daisuke Yamauchi, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/05 (2006.01); H05K 3/22 (2006.01); H05K 3/46 (2006.01); G11B 5/48 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/05 (2013.01); G11B 5/483 (2015.09); G11B 5/4853 (2013.01); H05K 1/117 (2013.01); H05K 3/22 (2013.01); H05K 3/3442 (2013.01); H05K 3/4608 (2013.01); H05K 3/4644 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10227 (2013.01); Y02P 70/613 (2015.11);
Abstract

A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, a conductor layer disposed at the one side of the base insulating layer and including a connecting terminal electrically connected to a slider, a cover insulating layer covering the conductor layer to expose the connecting terminal and disposed at the one side of the base insulating layer, and a plating layer covering the connecting terminal. The cover insulating layer includes a first cover insulating layer disposed at the one side of the base insulating layer and a second cover insulating layer disposed at the one side of the first cover insulating layer, and the thickness of the plating layer is not more than the total sum of the thickness of the first cover insulating layer and that of the second cover insulating layer.


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