The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2018
Filed:
Apr. 22, 2015
Applicant:
Ev Group E. Thallner Gmbh, St. Florian am Inn, AT;
Inventors:
Markus Wimplinger, Ried, AT;
Bernhard Rebhan, Haag a. H., AT;
Assignee:
EV Group E. Thallner GmbH, St. Florian am Inn, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 21/67092 (2013.01); H01L 21/67144 (2013.01); H01L 24/75 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/75343 (2013.01); H01L 2224/8303 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83206 (2013.01); H01L 2224/83207 (2013.01); H01L 2224/83895 (2013.01); H01L 2924/20108 (2013.01);
Abstract
A method and corresponding device for permanent bonding of a first layer of a first substrate to a second layer of a second substrate on a bond interface, characterized in that a dislocation density of a dislocation of the first and/or second layer is increased at least in the region of the bond interface before and/or during the bonding.