The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

Aug. 29, 2016
Applicant:

Amkor Technology, Inc., Tempe, AZ (US);

Inventors:

Won Chul Do, Kyunggi-do, KR;

Yong Jae Ko, Gwangju, KR;

Assignee:

AMKOR TECHNOLOGY, INC., Tempe, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 21/76879 (2013.01); H01L 24/02 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05083 (2013.01);
Abstract

A semiconductor device. For example and without limitation, various aspects of the present disclosure provide a semiconductor device that comprises a semiconductor die comprising an inactive die side and an active die side opposite the inactive die side, a through hole in the semiconductor die that extends between the inactive die side and the active die side where the through hole comprises an inner wall, an insulating layer coupled to the inner wall of the through hole, a through electrode inside of the insulating layer, a dielectric layer coupled to the inactive die side, and a conductive pad coupled to the through electrode.


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