The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

Jun. 12, 2015
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Masahito Furukawa, Tokyo, JP;

Masanori Kosuda, Tokyo, JP;

Saori Takeda, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C01G 23/00 (2006.01); C01G 25/00 (2006.01); C01G 35/00 (2006.01); H01G 4/30 (2006.01); H01G 4/10 (2006.01); H01G 4/12 (2006.01); H01G 4/33 (2006.01); C23C 14/08 (2006.01); C04B 35/49 (2006.01); C04B 35/495 (2006.01); C23C 14/00 (2006.01); C23C 14/28 (2006.01); C23C 18/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/10 (2013.01); C04B 35/49 (2013.01); C04B 35/495 (2013.01); C23C 14/0036 (2013.01); C23C 14/08 (2013.01); C23C 14/088 (2013.01); C23C 14/28 (2013.01); C23C 18/125 (2013.01); C23C 18/1216 (2013.01); C23C 18/1225 (2013.01); H01G 4/1227 (2013.01); C04B 2235/3201 (2013.01); C04B 2235/3203 (2013.01); C04B 2235/3208 (2013.01); C04B 2235/3213 (2013.01); C04B 2235/3215 (2013.01); C04B 2235/3251 (2013.01); C04B 2235/79 (2013.01); C23C 18/1254 (2013.01);
Abstract

A thin-film dielectric having a higher dielectric constant than usual ones and not requiring a special single crystal substrate, and a large-capacity thin-film capacitor element using the thin-film dielectric, in which a BaTiO-based perovskite solid solution and a KNbO-based perovskite solid solution are alternately formed to form a crystal structure gradient region where a lattice constant continuously changes at the interface, and thus crystal lattice strain occurs, thereby permitting the production of a thin-film dielectric having a high dielectric constant; also, a large-capacity thin-film capacitor element can be produced by using the thin-film dielectric of the present invention.


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