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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9944831 B1

PDFFull Text
Date of Patent:
Apr. 17, 2018

Filed:

Sep. 24, 2014

Heat-conductive adhesive sheet, manufacturing method for same, and electronic device using same

Applicant:

Lintec Corporation, Itabashi-ku, JP;

Inventors:

Wataru Morita, Saitama, JP;

Kunihisa Kato, Warabi, JP;

Tsuyoshi Mutou, Saitama, JP;

Assignee:

LINTEC CORPORATION, Itabashi-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Robert Harlan

Int. Cl.
CPC ...
C09J 7/00 (2006.01); C09J 9/02 (2006.01); H01L 35/32 (2006.01); C09J 9/00 (2006.01); C09J 11/04 (2006.01); C09J 175/04 (2006.01); C09J 183/04 (2006.01); C09J 201/00 (2006.01); H01L 35/30 (2006.01); H01L 35/34 (2006.01); C08G 18/62 (2006.01); C08G 18/81 (2006.01); C08K 3/08 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 3/38 (2006.01);
U.S. Cl.
CPC ...
C09J 7/00 (2013.01); C08G 18/6229 (2013.01); C08G 18/6254 (2013.01); C08G 18/8116 (2013.01); C09J 9/00 (2013.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); C09J 175/04 (2013.01); C09J 183/04 (2013.01); C09J 201/00 (2013.01); H01L 35/30 (2013.01); H01L 35/32 (2013.01); H01L 35/34 (2013.01); C08K 3/08 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); C09J 2201/40 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2475/00 (2013.01); C09J 2483/00 (2013.01);
Abstract

The present invention provides a thermally conductive adhesive sheet that can be easily laminated on an electronic device without an adhesive layer therebetween and can further selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same. The present invention includes a thermally conductive adhesive sheet comprising a high thermally conductive portion and a low thermally conductive portion, wherein the high thermally conductive portion and the low thermally conductive portion have adhesiveness, and the high thermally conductive portion and the low thermally conductive portion each independently constitute an entire thickness of the thermally conductive adhesive sheet, or at least either the high thermally conductive portion or the low thermally conductive portion constitutes a portion of a thickness of the thermally conductive adhesive sheet, and a method for producing the thermally conductive adhesive sheet, and an electronic device using the thermally conductive adhesive sheet.

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