The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

Jun. 02, 2015
Applicants:

Université D'aix-marseille, Marseilles, FR;

Centre National DE LA Recherche Scientifique, Paris, FR;

Thales, Neuilly sur Seine, FR;

Inventors:

Ludovic Escoubas, Marseilles, FR;

Gerard Jean Louis Berginc, Thiais, FR;

Jean-Jacques Simon, Peypin, FR;

Vincent Brissonneau, St Maximin la Sainte Baume, FR;

Assignees:

UNIVERSITÉ D'AIX-MARSEILLE, Marseilles, FR;

CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, Paris, FR;

THALES, Neuilly sur Seine, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/22 (2010.01); H01L 27/146 (2006.01); H01L 31/0236 (2006.01);
U.S. Cl.
CPC ...
H01L 33/22 (2013.01); H01L 27/14625 (2013.01); H01L 27/14685 (2013.01); H01L 31/02363 (2013.01); H01L 27/14621 (2013.01); H01L 27/14627 (2013.01); H01L 27/14643 (2013.01);
Abstract

The invention relates to a method for texturing a semiconductor substrate (), comprising steps consisting in forming a plurality of cavities of random shapes, depths and distribution, in an etch mask (), by means of non-homogeneous reactive-ion etching, forming a first rough random design, and etching the substrate using the etch mask, by means of reactive-ion etching, in such a way as to transfer the first rough random design into the substrate and to produce a second rough random design (), comprising cavities () of random shapes, depths (d) and distribution, on the surface of the substrate.


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