The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

Aug. 19, 2016
Applicant:

Transphorm Inc., Goleta, CA (US);

Inventors:

Umesh Mishra, Montecito, CA (US);

Robert Coffie, Camarillo, CA (US);

Likun Shen, Goleta, CA (US);

Ilan Ben-Yaacov, Goleta, CA (US);

Primit Parikh, Goleta, CA (US);

Assignee:

Transphorm Inc., Goleta, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 11/46 (2006.01); H01L 29/778 (2006.01); H01L 29/20 (2006.01); H01L 29/66 (2006.01); H01L 29/36 (2006.01); H01L 29/423 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 21/02 (2006.01); H01L 29/205 (2006.01); H01L 29/207 (2006.01); H01L 29/51 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7784 (2013.01); H01L 21/0217 (2013.01); H01L 21/0254 (2013.01); H01L 29/0847 (2013.01); H01L 29/1033 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/207 (2013.01); H01L 29/365 (2013.01); H01L 29/4236 (2013.01); H01L 29/518 (2013.01); H01L 29/66431 (2013.01); H01L 29/66462 (2013.01); H01L 29/7783 (2013.01); H01L 29/7787 (2013.01); H01L 29/7788 (2013.01);
Abstract

A III-N semiconductor device that includes a substrate and a nitride channel layer including a region partly beneath a gate region, and two channel access regions on opposite sides of the part beneath the gate. The channel access regions may be in a different layer from the region beneath the gate. The device includes an AlXN layer adjacent the channel layer wherein X is gallium, indium or their combination, and a preferably n-doped GaN layer adjacent the AlXN layer in the areas adjacent to the channel access regions. The concentration of Al in the AlXN layer, the AlXN layer thickness and the n-doping concentration in the n-doped GaN layer are selected to induce a 2DEG charge in channel access regions without inducing any substantial 2DEG charge beneath the gate, so that the channel is not conductive in the absence of a switching voltage applied to the gate.


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