The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2018
Filed:
May. 06, 2016
Amkor Technology, Inc., Tempe, AZ (US);
Young Rae Kim, Gwangju-si, KR;
Won Chul Do, Bucheon-si, KR;
Ji Hun Lee, Seoul, KR;
Min Hwa Chang, Seoul, KR;
Dong Hyun Kim, Jeju-si, KR;
Wang Gu Lee, Goyang-si, KR;
Jin Ryang Hwang, Gwangju-si, KR;
Mi Kyeong Choi, Seoul, KR;
Amkor Technology, Inc., Tempe, AZ (US);
Abstract
A semiconductor package and a manufacturing method thereof, which can reduce the size of the semiconductor package and improve product reliability. In a non-limiting example embodiment, the method may comprise forming an interposer on a wafer, forming at least one reinforcement member on the interposer, coupling and electrically connecting at least one semiconductor die to the interposer to the interposer, filling a region between the semiconductor die and the interposer with an underfill, and encapsulating the reinforcement member, the semiconductor die and the underfill on the interposer using an encapsulant.