The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

Apr. 26, 2017
Applicant:

Sanken Electric Co., Ltd., Niiza-shi, Saitama, JP;

Inventors:

Hiromichi Kumakura, Niiza, JP;

Tomonori Hotate, Niiza, JP;

Hiroko Kawaguchi, Niiza, JP;

Hiroshi Shikauchi, Niiza, JP;

Ryohei Baba, Niiza, JP;

Yuki Tanaka, Niiza, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/04 (2006.01); H01L 29/872 (2006.01); H01L 23/31 (2006.01); H01L 29/16 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0495 (2013.01); H01L 21/02063 (2013.01); H01L 21/02236 (2013.01); H01L 21/02334 (2013.01); H01L 21/045 (2013.01); H01L 23/3171 (2013.01); H01L 29/0619 (2013.01); H01L 29/1608 (2013.01); H01L 29/872 (2013.01);
Abstract

A semiconductor device includes a semiconductor base body having a first main surface and a second main surface, the first main surface and the second main surface being opposite with each other; a Schottky electrode that is disposed on the first main surface and forms a Schottky junction with the semiconductor base body; and a barrier metal layer that is brought into ohmic contact with the first main surface around the Schottky electrode and covers a side surface of the Schottky electrode.


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