The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

Jan. 23, 2014
Applicant:

Kemet Electronics Corporation, Simpsonville, SC (US);

Inventors:

Brandon Summey, Simpsonville, SC (US);

Jeffrey Poltorak, Simpsonville, SC (US);

Assignee:

KEMET ELECTRONICS CORPORATION, Simpsonville, SC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/012 (2006.01); H01G 9/10 (2006.01); H01G 9/15 (2006.01);
U.S. Cl.
CPC ...
H01G 9/012 (2013.01); H01G 9/10 (2013.01); H01G 9/15 (2013.01); Y10T 29/435 (2015.01);
Abstract

An improved capacitor is provided with at least one anode having a dielectric on the anode and an anode lead extending from the anode. A conductive cathode layer is on the dielectric. An anode leadframe is electrically connected to the anode and a cathode leadframe is electrically connected to the cathode. An encapsulant encases the anode, a portion of the anode leadframe and a portion of the cathode leadframe such that the anode leadframe extends from the encapsulant to form an external anode leadframe and the cathode leadframe extends from the encapsulant to form an external cathode leadframe. At least one secondary electrical connection is provided wherein the secondary electrical connection is in electrical contact with the cathode and extends through the encapsulant to the external cathode leadframe or the secondary electrical contact is in electrical contact with the anode and extends through the encapsulant to the external anode leadframe.


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