The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

Feb. 17, 2016
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Tae Hong Ha, San Jose, CA (US);

Sang Ho Yu, Cupertino, CA (US);

Kiejin Park, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/06 (2006.01); C23C 16/50 (2006.01); C23C 16/46 (2006.01); C23C 16/505 (2006.01); C23C 16/02 (2006.01); C23C 16/16 (2006.01); C23C 16/18 (2006.01); C23C 28/00 (2006.01); H01L 21/285 (2006.01); H01L 21/768 (2006.01); C23C 16/513 (2006.01);
U.S. Cl.
CPC ...
C23C 16/46 (2013.01); C23C 16/0281 (2013.01); C23C 16/16 (2013.01); C23C 16/18 (2013.01); C23C 16/505 (2013.01); C23C 16/513 (2013.01); C23C 28/322 (2013.01); C23C 28/34 (2013.01); H01L 21/28556 (2013.01); H01L 21/76841 (2013.01); H01L 21/76873 (2013.01); H01L 2221/1089 (2013.01);
Abstract

Methods for depositing ruthenium by a PECVD process are described herein. Methods for depositing ruthenium can include positioning a substrate in a processing chamber, the substrate having a barrier layer formed thereon, heating and maintaining the substrate at a first temperature, flowing a first deposition gas into a processing chamber, the first deposition gas comprising a ruthenium containing precursor, generating a plasma from the first deposition gas to deposit a first ruthenium layer over the barrier layer, flowing a second deposition gas into the processing chamber to deposit a second ruthenium layer over the first ruthenium layer, the second deposition gas comprising a ruthenium containing precursor, depositing a copper seed layer over the second ruthenium layer and annealing the substrate at a second temperature.


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