The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

May. 11, 2016
Applicant:

Veeco Instruments Inc., Plainview, NY (US);

Inventors:

Bojan Mitrovic, Somerset, NJ (US);

Guanghua Wei, Dayton, NJ (US);

Eric A. Armour, Pennington, NJ (US);

Ajit Paranjpe, Basking Ridge, NJ (US);

Assignee:

Veeco Instruments Inc., Plainview, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01); C23C 16/458 (2006.01); H01L 21/687 (2006.01); C30B 25/16 (2006.01); C30B 29/06 (2006.01); C23C 16/46 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4585 (2013.01); C23C 16/4584 (2013.01); C23C 16/45504 (2013.01); C23C 16/45508 (2013.01); C23C 16/45591 (2013.01); C23C 16/46 (2013.01); C30B 25/165 (2013.01); C30B 29/06 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/68735 (2013.01); H01L 21/68764 (2013.01); H01L 21/68771 (2013.01); H01L 21/68785 (2013.01);
Abstract

Methods are provided for treating wafers using a wafer carrier rotated about an axis. The wafer carrier is provided with a ring which surrounds the wafer carrier during operation. Treatment gasses directed onto a top surface of the carrier flow outwardly away from the axis over the carrier and over the ring, and pass downstream outside of the ring. The outwardly flowing gasses form a boundary over the carrier and ring. The ring helps to maintain a boundary layer of substantially uniform thickness over the carrier, which promotes uniform treatment of the wafers.


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