The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

Aug. 18, 2016
Applicants:

Stmicroelectronics Asia Pacific Pte Ltd, Singapore, SG;

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Stmicroelectronics, Inc., Coppell, TX (US);

Inventors:

Teck Khim Neo, Singapore, SG;

Mauro Pasetti, Milan, IT;

Franco Consiglieri, Piacenza, IT;

Luca Molinari, Piacenza, IT;

Andrea Nicola Colecchia, Agrate Brianza, IT;

Simon Dodd, West Linn, OR (US);

Assignees:

STMICROELECTRONICS ASIA PACIFIC PTE LTD, Singapore, SG;

STMICROELECTRONICS S.R.L., Agrate Brianza, IT;

STMICROELECTRONICS, INC., Coppell, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B05B 1/24 (2006.01);
U.S. Cl.
CPC ...
B81B 7/008 (2013.01); B05B 1/24 (2013.01); B81B 2201/05 (2013.01); B81B 2207/012 (2013.01); B81B 2207/091 (2013.01);
Abstract

The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.


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