The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Jun. 08, 2016
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventor:

Jaroslav Hynecek, Allen, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 5/335 (2011.01); H04N 5/355 (2011.01); H01L 27/146 (2006.01); H04N 5/353 (2011.01); H04N 5/349 (2011.01); H04N 5/363 (2011.01);
U.S. Cl.
CPC ...
H04N 5/355 (2013.01); H01L 27/1464 (2013.01); H01L 27/14616 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H04N 5/349 (2013.01); H04N 5/3532 (2013.01); H04N 5/3559 (2013.01); H04N 5/363 (2013.01);
Abstract

Imaging pixels may be operated in a rolling shutter scanning mode. Charge signal that is generated on a first chip may be capacitively coupled to signal processing circuits on a second chip. A capacitor may be placed in the signal path that provides signal coupling between the chips and stores overflow charge from pixels that have been exposed to high light level illumination. This enables high dynamic range using only a single charge integration time. The pixel may include an in-pixel negative feedback amplifier. The chip-to-chip electrical connections between the first and second chips may be realized at each pixel as a hybrid bond with a single bond per pixel. Image sensors fabricated using this technology may have small size pixels, high resolution, high dynamic range, and a single charge integration time.


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