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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9935053 B1

PDFFull Text
Date of Patent:
Apr. 03, 2018

Filed:

Jan. 19, 2017

Electronic component integrated substrate

Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Satoshi Shiraki, Nagano, JP;

Koichi Tanaka, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;

Attorney:

IPUSA, PLLC

Primary Examiner:

Whitney T Moore

Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H05K 1/14 (2006.01); H01L 21/48 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 23/3142 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H05K 1/144 (2013.01); H05K 3/3436 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/10977 (2013.01);
Abstract

An electronic component integrated substrate includes a first substrate including a first pad, a first solder resist layer provided with a first open portion that selectively exposes the first pad, and a connection pad formed on the first solder resist layer, and electrically connected to the first pad; a second substrate, stacked on the first substrate, including a second pad, and a second solder resist layer formed on the second pad and provided with a second open portion that selectively exposes the second pad; an electronic component mounted on the first substrate and sandwiched between the first substrate and the second substrate; and a substrate connection member that electrically connects the connection pad and the second pad with each other, the diameter of the connection pad being larger than each of the diameter of the first pad and the diameter of the second open portion.

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