The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2018
Filed:
Sep. 28, 2017
Shinko Electric Industries Co., Ltd., Nagano, JP;
Kei Imafuji, Nagano, JP;
Satoshi Fujii, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
An interconnection substrate includes a first insulating layer, and an interconnection structure formed on the first insulating layer, wherein the interconnection structure includes an interconnection pattern having a first metal layer, a second metal layer formed on the first metal layer, and a third metal layer formed on the second metal layer, and a fourth metal layer covering an upper surface and side surface of the interconnection pattern, wherein an outer perimeter of the second metal layer protrudes at the side surface of the interconnection pattern to form a first protrusion, and the fourth metal layer has a second protrusion that protrudes at a side surface of the interconnection structure at a position corresponding to the first protrusion.