The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Feb. 13, 2015
Applicants:

Tyco Electronics Raychem Gmbh, Ottobrunn, DE;

Tyco Electronics Corporation, Berwyn, PA (US);

Inventors:

Ladislaus Kehl, Dorfen, DE;

Terry Edward Frye, Cary, NC (US);

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02G 1/12 (2006.01); H01B 13/016 (2006.01); B24B 19/02 (2006.01); B24B 23/08 (2006.01); B24B 27/00 (2006.01); H02G 1/14 (2006.01); C09D 5/24 (2006.01); H01B 1/24 (2006.01); H01B 3/30 (2006.01);
U.S. Cl.
CPC ...
H01B 13/016 (2013.01); B24B 19/02 (2013.01); B24B 23/08 (2013.01); B24B 27/003 (2013.01); C09D 5/24 (2013.01); H01B 1/24 (2013.01); H01B 3/30 (2013.01); H02G 1/1239 (2013.01); H02G 1/1285 (2013.01); H02G 1/14 (2013.01); Y10T 29/49117 (2015.01); Y10T 83/0304 (2015.04); Y10T 83/0385 (2015.04);
Abstract

A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.


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