The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

Oct. 08, 2015
Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventors:

Mitsuhiro Tomikawa, Ogaki, JP;

Kota Noda, Ogaki, JP;

Nobuhisa Kuroda, Ogaki, JP;

Haruhiko Morita, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 3/46 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01); H01L 23/31 (2006.01); H01G 2/06 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4697 (2013.01); H01G 4/12 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H01G 2/06 (2013.01); H01L 23/3128 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73267 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15331 (2013.01); H05K 1/115 (2013.01); H05K 3/429 (2013.01); H05K 3/4644 (2013.01); H05K 2201/09545 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/10015 (2013.01);
Abstract

A wiring board with a built-in electronic component includes a substrate having a cavity, an interlayer insulating layer formed on the substrate such that the interlayer insulating layer is covering the cavity of the substrate, a conductor layer formed on the interlayer insulating layer, an electronic component accommodated in the cavity of the substrate and including a rectangular cuboid body and three terminal electrodes such that each of the three terminal electrodes has a metal film form formed on an outer surface of the rectangular cuboid body, and via conductors formed in the interlayer insulating layer such that the via conductors are connecting the conductor layer and the three terminal electrodes of the electronic component. The three terminal electrodes are arrayed in parallel on the outer surface of the rectangular cuboid body such that adjacent terminal electrodes have the opposite polarities.


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