The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

Aug. 26, 2011
Applicants:

Kie Y. Ahn, Chappaqua, NY (US);

Leonard Forbes, Corvallis, OR (US);

Inventors:

Kie Y. Ahn, Chappaqua, NY (US);

Leonard Forbes, Corvallis, OR (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 41/04 (2006.01); H01F 17/00 (2006.01); H01L 49/02 (2006.01); H01L 27/08 (2006.01); H01P 11/00 (2006.01); H01P 9/02 (2006.01); H01F 27/36 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); H01F 17/0013 (2013.01); H01F 41/043 (2013.01); H01F 41/046 (2013.01); H01L 27/08 (2013.01); H01F 27/365 (2013.01); H01P 9/02 (2013.01); H01P 11/007 (2013.01); Y10T 29/4902 (2015.01); Y10T 29/4906 (2015.01); Y10T 29/49062 (2015.01); Y10T 29/49069 (2015.01); Y10T 29/49071 (2015.01); Y10T 29/49073 (2015.01); Y10T 29/49075 (2015.01);
Abstract

Various embodiments includes a stacked open pattern inductor fabricated above a semiconductor substrate. The stacked open pattern inductor includes a plurality of parallel open conducting patterns embedded in a magnetic oxide or in an insulator and a magnetic material. A layer of magnetic material may be located above the inductor and below the inductor to confine electronic noise generated in the stacked open pattern inductor to the area occupied by the inductor. The stacked open pattern inductor may include a magnetic material directly contacts one of the conducting patterns and the substrate. The stacked open pattern inductor may be fabricated using conventional integrated circuit manufacturing processes, and the inductor may be used in connection with computer systems.


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