The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

Apr. 11, 2016
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Kang Hyun Lee, Suwon-si, KR;

Sung Min Song, Suwon-si, KR;

Jung Gon Choi, Suwon-si, KR;

Heung Woo Park, Suwon-si, KR;

Jae Hyun Lim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 27/14683 (2013.01);
Abstract

An image sensor assembly, a method of manufacturing the same, and a camera module are provided. The image sensor assembly includes an image sensor including a pixel region provided on a surface of the image sensor, a cover disposed above the pixel region, a spacer disposed on a surface of the cover and the spacer being configured to maintain a distance between the image sensor and the cover, and an adhesive configured to fixedly attach the spacer to the image sensor, wherein the spacer comprises a first and a second member disposed parallel to and at a distance from each other.


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