The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2018
Filed:
Jun. 26, 2014
Applicant:
Ev Group E. Thallner Gmbh, St. Florian am Inn, AT;
Inventor:
Jurgen Burggraf, Scharding, AT;
Assignee:
EV GROUP E. THALLNER GMBH, St. Florian am Inn, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 23/00 (2006.01); C03C 27/10 (2006.01); C09J 5/00 (2006.01); C23C 14/58 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); C03C 27/10 (2013.01); C09J 5/00 (2013.01); C23C 14/5826 (2013.01); H01L 24/03 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/743 (2013.01); C09J 2400/143 (2013.01); H01L 2224/038 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/2731 (2013.01); H01L 2224/27318 (2013.01); H01L 2224/27416 (2013.01); H01L 2224/27418 (2013.01); H01L 2224/29015 (2013.01); H01L 2224/29017 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/32135 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/831 (2013.01); H01L 2224/83022 (2013.01); H01L 2224/83048 (2013.01); H01L 2224/83102 (2013.01); H01L 2224/83121 (2013.01); H01L 2224/83143 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83194 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83868 (2013.01); H01L 2224/83871 (2013.01); H01L 2224/83874 (2013.01);
Abstract
A method for bonding a first substrate with a second substrate by means of a connecting layer that is arranged between the substrates and that is comprised of a connecting material with the following steps: applying the connecting material to the first substrate and/or the second substrate in liquid form, and distributing the connecting material between the substrates by bringing the substrates closer and as a result forming the shape of the connecting layer with a thickness t.