The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2018
Filed:
Apr. 28, 2015
Applicant:
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;
Inventor:
Nick Renaud-Bezot, Leoben, AT;
Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 29/40 (2006.01); H01L 23/538 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 21/4857 (2013.01); H01L 21/52 (2013.01); H01L 23/3178 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73253 (2013.01);
Abstract
An electronic assembly includes (a) a base carrier structure having a cavity formed therein, (b) a cover carrier structure, and (c) an electronic component disposed within the cavity and connected electrically and/or thermally both with the cover carrier structure and with the base carrier structure. The base carrier structure is made at least partially from a printed circuit board. Preferably, also the cover carrier structure is made at least partially from a further printed circuit board. A method for manufacturing such an electronic assembly is also described.