The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2018
Filed:
Jan. 14, 2016
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Wen-Long Lu, Kaohsiung, TW;
Chi-Chang Lee, Kaohsiung, TW;
Wei-Min Hsiao, Kaohsiung, TW;
Yuan-Feng Chiang, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor package structure includes a conductive structure, at least two semiconductor elements and an encapsulant. The conductive structure has a first surface and a second surface opposite the first surface. The semiconductor elements are disposed on and electrically connected to the first surface of the conductive structure. The encapsulant covers the semiconductor elements and the first surface of the conductive structure. The encapsulant has a width 'L' and defines at least one notch portion. A minimum distance 'd' is between a bottom surface of the notch portion and the second surface of the conductive structure. The encapsulant has a Young's modulus ‘E’ and a rupture strength ‘S’, and L/(K×d)>E/Sr, wherein ‘K’ is a stress concentration factor with a value of greater than 1.2.