The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

Oct. 07, 2015
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yu Wamura, Iwate, JP;

Fumiaki Hayase, Iwate, JP;

Masahiko Kaminishi, Iwate, JP;

Yu Sasaki, Iwate, JP;

Kosuke Takahashi, Iwate, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/02 (2006.01); H01L 21/687 (2006.01); C23C 16/455 (2006.01); C23C 16/44 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02271 (2013.01); C23C 16/4401 (2013.01); C23C 16/455 (2013.01); C23C 16/45551 (2013.01); H01L 21/02189 (2013.01); H01L 21/68764 (2013.01); H01L 21/68771 (2013.01);
Abstract

A substrate processing method is provided. In the method, a plurality of substrates is placed on a plurality of substrate holding areas provided in a surface of a turntable at predetermined intervals in a circumferential direction, the turntable being provided in a processing chamber. Next, the turntable on which the plurality of substrates is placed is rotated. Then, a fluid is supplied to the surface of the turntable while rotating the turntable. Here, the fluid is supplied to an area between the plurality of substrate holding areas in response to an operation of changing a flow rate of the fluid.


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