The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

Mar. 04, 2016
Applicants:

Brad Lemon, Battle Creek, MI (US);

Joseph Hirt, Cypress, TX (US);

Timothy Welling, Portage, MI (US);

James G. Daily, Iii, Marshall, MI (US);

David Meendering, Coldwater, MI (US);

Gary Rozak, Akron, OH (US);

Jerome O'grady, Hudson Village, OH (US);

Prabhat Kumar, Framingham, MA (US);

Steven A. Miller, Canton, MA (US);

Rong-chein Richard Wu, North Chelmsford, MA (US);

David G. Schwartz, Mentor, OH (US);

Inventors:

Brad Lemon, Battle Creek, MI (US);

Joseph Hirt, Cypress, TX (US);

Timothy Welling, Portage, MI (US);

James G. Daily, III, Marshall, MI (US);

David Meendering, Coldwater, MI (US);

Gary Rozak, Akron, OH (US);

Jerome O'Grady, Hudson Village, OH (US);

Prabhat Kumar, Framingham, MA (US);

Steven A. Miller, Canton, MA (US);

Rong-chein Richard Wu, North Chelmsford, MA (US);

David G. Schwartz, Mentor, OH (US);

Assignee:

H.C. STARCK INC., Newton, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); B22F 3/16 (2006.01); C22C 1/04 (2006.01); C22C 27/04 (2006.01); C23C 14/35 (2006.01); C23C 14/46 (2006.01); B22F 1/00 (2006.01); B22F 5/00 (2006.01); C21D 8/02 (2006.01); C22F 1/18 (2006.01); C23C 14/14 (2006.01); B22F 3/24 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3414 (2013.01); B22F 1/0003 (2013.01); B22F 3/16 (2013.01); B22F 3/162 (2013.01); B22F 3/24 (2013.01); B22F 5/006 (2013.01); C21D 8/0221 (2013.01); C21D 8/0247 (2013.01); C22C 1/045 (2013.01); C22C 27/04 (2013.01); C22F 1/18 (2013.01); C23C 14/14 (2013.01); C23C 14/3478 (2013.01); C23C 14/3485 (2013.01); C23C 14/35 (2013.01); C23C 14/46 (2013.01); B22F 2003/248 (2013.01); B22F 2301/20 (2013.01); B22F 2998/00 (2013.01); B22F 2998/10 (2013.01);
Abstract

In various embodiments, sputtering targets are formed by introducing molybdenum powder into a sheet bar mold, pressing the powder to form a sheet bar, sintering the sheet bar to form an ingot having a density of at least 90% of a theoretical density, preheating the ingot, rolling the ingot to form a plate, and heat treating the plate.


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