The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2018
Filed:
Sep. 04, 2015
Applicant:
Sunedison Semiconductor Limited (Uen201334164h), Singapore, SG;
Inventors:
Gregory A. Young, O'Fallon, MO (US);
Jeffrey L. Libbert, O'Fallon, MO (US);
Assignee:
SunEdison Semiconductor Limited (UEN201334164H), Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); H01L 21/67 (2006.01); B32B 43/00 (2006.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); B32B 38/10 (2013.01); H01L 21/67092 (2013.01); C09J 2205/302 (2013.01); H01L 2221/6839 (2013.01); H01L 2221/68386 (2013.01); Y10S 156/93 (2013.01); Y10S 156/941 (2013.01); Y10T 156/1168 (2015.01); Y10T 156/1184 (2015.01); Y10T 156/1961 (2015.01); Y10T 156/1978 (2015.01); Y10T 225/10 (2015.04); Y10T 225/12 (2015.04); Y10T 225/357 (2015.04); Y10T 225/393 (2015.04);
Abstract
Apparatus and methods for mechanically cleaving a bonded wafer structure are disclosed. The apparatus and methods involve clamps that grip the bonded wafer structure and are actuated to cause the bonded structure to cleave.