The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2018
Filed:
Dec. 11, 2014
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Beom-Taek Lee, Mountain View, CA (US);
Raul Enriquez Shibayama, Zapopan, MX;
Assignee:
INTEL CORPORATION, Santa Clara, unknown;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/18 (2006.01); H05K 7/00 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H01R 12/58 (2011.01); H01R 12/71 (2011.01); H01R 31/06 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/147 (2013.01); H05K 1/184 (2013.01); H01R 12/585 (2013.01); H01R 12/718 (2013.01); H01R 31/06 (2013.01); H05K 2201/1059 (2013.01); H05K 2201/10295 (2013.01); H05K 2201/10356 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10545 (2013.01); H05K 2201/10704 (2013.01); H05K 2201/10901 (2013.01);
Abstract
In one embodiment, the apparatus comprises: a substrate having a first side and a second side, the second side being on an opposite side of the substrate from the first side, where the substrate has a first location on the first side at which an semiconductor package is to be coupled; and a cable coupled to the substrate on the second side of the substrate at a second location on the second side, the second location being at least partially below the first location.