The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2018

Filed:

Nov. 03, 2016
Applicant:

Omnivision Technologies, Inc., Santa Clara, CA (US);

Inventors:

Chih-Wei Hsiung, San Jose, CA (US);

Duli Mao, Sunnyvale, CA (US);

Vincent Venezia, Los Gatos, CA (US);

Gang Chen, San Jose, CA (US);

Dyson H. Tai, San Jose, CA (US);

Assignee:

OmniVision Technologies, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 21/762 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1463 (2013.01); H01L 21/30604 (2013.01); H01L 21/76224 (2013.01); H01L 27/14629 (2013.01); H01L 27/14643 (2013.01); H01L 27/14685 (2013.01); H01L 27/14621 (2013.01); H01L 27/14627 (2013.01);
Abstract

An image sensor includes a plurality of photodiodes disposed in a semiconductor material between a first side and a second side of the semiconductor material. The image sensor also includes a plurality of hybrid deep trench isolation (DTI) structures disposed in the semiconductor material, where individual photodiodes in the plurality of photodiodes are separated by individual hybrid DTI structures. The individual hybrid DTI structures include a shallow portion that extends from the first side towards the second side of the semiconductor material, and the shallow portion includes a dielectric region and a metal region such that at least part of the dielectric region is disposed between the semiconductor material and the metal region. The hybrid DTI structures also include a deep portion that extends from the shallow portion and is disposed between the shallow portion and the second side of the semiconductor material.


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