The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2018

Filed:

Mar. 06, 2017
Applicant:

Cypress Semiconductor Corporation, San Jose, CA (US);

Inventors:

Krishnaswamy Ramkumar, San Jose, CA (US);

Igor G. Kouznetsov, San Francisco, CA (US);

Venkatraman Prabhakar, Pleasanton, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/115 (2017.01); H01L 27/11568 (2017.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/51 (2006.01); H01L 29/49 (2006.01); H01L 29/423 (2006.01); H01L 29/167 (2006.01); H01L 27/11573 (2017.01); H01L 27/1157 (2017.01); H01L 21/8234 (2006.01); H01L 27/088 (2006.01); H01L 29/792 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11568 (2013.01); H01L 21/823462 (2013.01); H01L 27/088 (2013.01); H01L 27/1157 (2013.01); H01L 27/11573 (2013.01); H01L 29/167 (2013.01); H01L 29/42344 (2013.01); H01L 29/42348 (2013.01); H01L 29/495 (2013.01); H01L 29/4916 (2013.01); H01L 29/4966 (2013.01); H01L 29/513 (2013.01); H01L 29/517 (2013.01); H01L 29/518 (2013.01); H01L 29/66833 (2013.01); H01L 29/7843 (2013.01); H01L 29/792 (2013.01);
Abstract

Memory devices and methods for forming the same are disclosed. In one embodiment, the device includes a non-volatile memory (NVM) transistor formed in a first region of a substrate, the NVM transistor comprising a channel and a gate stack on the substrate overlying the channel. The gate stack includes a dielectric layer on the substrate, a charge-trapping layer on the dielectric layer, an oxide layer overlying the charge-trapping layer, a first gate overlying the oxide layer, and a first silicide region overlying the first gate. The device includes a metal-oxide-semiconductor transistor formed in a second region of the substrate comprising a gate oxide overlying the substrate in the second region, a second gate overlying the gate oxide, and second silicide region overlying the second gate. A strain inducing structure overlies at least the NVM transistor and a surface of the substrate in the first region of the substrate.


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